BT 5.3 IC BES2600Z Dual-Core BT Audio SoC Chip QFN Package

BT 5.3 IC BES2600Z Dual-Core BT Audio SoC Chip QFN Package

Product Description Of BES2600Z

BES2600Z BT audio SoC with internal integrated dual-core ARM Cortex-M4F CPU and ultra-low-power Sensor Hub sub-system has powerful application processing capability, supports BT 5.3, hybrid active noise cancellation and AI call noise cancellation, providing stable wireless connectivity and rich features for the headset.

BES2600Z high-performance TWS+ANC noise cancellation solution

• Support BT dual mode V5.3, BT audio

• Support SBC/AAC/LHDC/LLAC/LC3

• ultra-high compatibility, support for the vast majority of headphones on the market

• Support a drag two, while connecting two TWS headphones or two headset, headphones; listening to songs and watching films can be shared with family members.

• Support dual-mode online;

• Ultra-low power consumption, music launch power consumption as low as 5mA level

• Support ultra-low latency launch, LE Audio the entire link as low as 28ms

Other Electronic Components In Stock

FAQ

Q: Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q: Which Certificates do you have?
A: We are ISO 9001:2015 Certified Company and member of ERAI.
Q: Can you support small quantity order or sample?Is the sample free?
A: Yes,we support sample order and small order.Sample cost is different according to your order or project.
Q: How to ship my order? Is it safe?
A: We use express to ship,such as DHL,Fedex,UPS,TNT,EMS.We can also use your suggested forwarder.Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q: What about the lead time?
A: We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.

Bluetooth Integrated Circuit

BT Chip

Bluetooth IC Chip

BT 5.3 IC BES2600Z Dual-Core BT Audio SoC Chip QFN Package Images